[Guest Profile] Paul Li, President of the Hong Kong Fintech Industry Association, to Attend Web3 Payment Re-imagined

Paul Li, the President of the Hong Kong Fintech Industry Association, has confirmed that he will attend the “Web3 Payment Re-imagined” themed forum, co-hosted by Wanxiang Blockchain Labs, HashKey Group, and PlatON, on the afternoon of April 7, 2024.

After having gained a wealth of experience in banking and fintech across traditional banks and fintech / big-tech companies, Paul currently specializes in cross border payment and digital currency.  

As a fintech veteran, Paul is now the general manager of Banking Circle in the Greater China region. Banking Circle is a fintech bank in Europe focusing on providing cross border payment infrastructure to financial institutions. Prior to Banking Circle, Paul is the head of B2B payments and cash management in the Alibaba group, where he used technology to enable inclusive financial products for SMEs. Prior to his fintech journey, Paul undertook various roles across a number of traditional banks. In 2007, seeing the opportunity for foreign banks under the WTO agreement, Paul moved from the Hong Kong office to the Shanghai office of HSBC in order to manage the strategy department for HSBC China. Until 2013, Paul ventured around different cities in China to build corporate banking franchises for HSBC, Standard Chartered and subsequently BNP Paribas.

Currently, Paul is the President of Hong Kong Fintech Industry Association, which is founded in 2014 and aims at facilitating the interaction between fintech companies in Hong Kong and China and promoting the collaboration between fintech and traditional finance industry. Apart from his involvement in fintech, Paul has also participated in public services like an adviser of Our Hong Kong Foundation, co-director of Law and Web3 Joint Lab of HK Polytechnic University, a research fellow of Zhejiang University Academy of Internet Finance, a part-time lecturer of HKU SPACE and an industry commentator on topics of fintech and regtech.

About “Web3 Payment Re-imagined” Forum:

As a key sub-forum of the “Hong Kong Web3 Festival 2024,” the “Web3 Payment Re-imagined” themed forum will invite several heavyweight guests from around the world to engage in in-depth discussions on critical topics such as Tokenization, Real-World Assets (RWA), stablecoins, and payments, collectively envisioning the future of global payments under Web3. Through the insightful presentations and intellectual exchanges among guests from diverse backgrounds, including the banking sector, acquirers, card issuers, investment institutions, and regulatory bodies, the forum will analyze and forecast how blockchain technology can reshape the global payment ecosystem. It aims to unveil the core technologies, application scenarios, regulatory landscape, and market trends in the Web3 payment domain for attendees.

As one of the largest Web3 events globally, Hong Kong Web3 Festival 2024 will be taking place from 6-9 April, 2024. The event will feature an amazing lineup of industry guests from around the globe, bringing together the world’s brightest minds, top Web3 projects and leading venture capitals presenting content-rich discussions and topics centered around Web3. Hong Kong regulatory representatives will also dive into and interpret the latest digital asset regulation policies.