[Guest Profile] Chia Hock Lai, Co-chairman of Digital Assets Association, to Attend Web3 Payment Re-imagined

Chia Hock Lai, Co-chairman of Digital Assets Association, has confirmed that he will attend the “Web3 Payment Re-imagined” themed forum, co-hosted by Wanxiang Blockchain Labs, HashKey Group, and PlatON, on the afternoon of April 7, 2024.

Chia Hock Lai is the chairman of the New Economy Skills Training (NEST) Institute and a highly accomplished professional in the financial and technology industry, with more than two decades of experience. He has held positions in various organizations, including the Government Technology Agency of Singapore (GovTech) and NTUC Income. He is an alumnus of the National University of Singapore (NUS) and Nanyang Technological University (NTU), and has received several prestigious fellowships for his contributions to digital transformation and skills development, such as the Institute of Banking & Finance (IBF) Fellow for Digital Transformation, SkillsFuture (SSG) Fellow and Singapore University of Social Sciences (SUSS) Fintech Fellow.

In addition, Hock Lai active in the non-profit sector and is a co-chairman of the Global Fintech institute and the Digital Assets Association, former & founding president of the Singapore FinTech Association (SFA) and former chairman of the Blockchain Association Singapore (BAS). He is also involved in various advisory and board member roles in organizations like the IEEE Computer Society Blockchain and Distributed Ledger Standards Committee (IEEE C/BDL), the NTUC-U Care Fund, and Nanyang Polytechnic (NYP). He is also an advisor to financial institutions and startups, and a frequent speaker on topics related to digital transformation, fintech and blockchain at international events and universities.

About “Web3 Payment Re-imagined” Forum:

As a key sub-forum of the “Hong Kong Web3 Festival 2024,” the “Web3 Payment Re-imagined” themed forum will invite several heavyweight guests from around the world to engage in in-depth discussions on critical topics such as Tokenization, Real-World Assets (RWA), stablecoins, and payments, collectively envisioning the future of global payments under Web3. Through the insightful presentations and intellectual exchanges among guests from diverse backgrounds, including the banking sector, acquirers, card issuers, investment institutions, and regulatory bodies, the forum will analyze and forecast how blockchain technology can reshape the global payment ecosystem. It aims to unveil the core technologies, application scenarios, regulatory landscape, and market trends in the Web3 payment domain for attendees.

As one of the largest Web3 events globally, Hong Kong Web3 Festival 2024 will be taking place from 6-9 April, 2024. The event will feature an amazing lineup of industry guests from around the globe, bringing together the world’s brightest minds, top Web3 projects and leading venture capitals presenting content-rich discussions and topics centered around Web3. Hong Kong regulatory representatives will also dive into and interpret the latest digital asset regulation policies.